ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,816, issued on Aug. 4, was assigned to Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V. (Munich) and Ultra High Vacuum So... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,817, issued on Aug. 4, was assigned to INTERNATIONAL SOLAR ENERGY RESEARCH CENTER KONSTANZ E.V. (Constance, Germany). "Method for local modi... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,818, issued on Aug. 4. "Camera having a reduced dark current photodetector" was invented by Shimon Maimon (Rochester, N.Y.). According to t... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,819, issued on Aug. 4, was assigned to Silfab Solar Cells SC Inc. (Fort Mill, S.C.). "Back-side contact solar cell" was invented by Erik Hof... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,820, issued on Aug. 4, was assigned to LONGI PHOTOVOLTAIC TECHNOLOGY (ORDOS) Co. LTD. (Ordos, China). "Solar cell and photovoltaic module" w... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,821, issued on Aug. 4, was assigned to LG Electronics Inc. (Seoul, South Korea). "Transfer device for semiconductor light emitting device an... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,822, issued on Aug. 4, was assigned to NIKKISO Co. LTD. (Tokyo). "Method of manufacturing semiconductor light-emitting element" was invented... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,823, issued on Aug. 4, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Light emitting element and method of fabricating ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,824, issued on Aug. 4, was assigned to PORO TECHNOLOGIES LTD (Cambridge, Great Britain). "Micro-LED and method of manufacture" was invented ... Read More
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,825, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Curved semiconductor chip and met... Read More